mediatek: MediaTek launches Dimensity 8100, Dimensity 8000 and Dimensity 1300 chipsets

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To expand its chipset portfolio, MediaTek Announces the all-new Dimension 8000 series for budget premium smartphones. The company also unveiled the Mid-Range Dimension 1300 chipset.
Regular Dimension 8000 and in Dimension 8000 series Level 8100 Chips. According to the company, the new chipsets are expected to bring flagship-level features, connectivity and performance to budget flagship smartphones.
The new chipsets are based on the technology used with the Dimension 9000 platform and are built using it. TSMC 5nm manufacturing process.
The Dimension 8100 and Dimension 8000 chips both have a total of eight cores. Also, both chips are equipped with four high performance ARM Cortex-A78 cores. However, the cores of Dimension 8100 are clocked at 2.85GHz, while at Dimension 8000, the cores are clocked at 2.75GHz.
Also, both chips come with MediaTek HyperEngine 5.0 ARM Mali-G6 GPU with gaming technology. The chipset also supports LPDDR5 memory UFS 3.1 Storage.
MediaTek’s has also been used in the new Dimensity 8000 series Open resource architecture To give the device manufacturers flexibility to customize and differentiate features.
The Dimension 8000 series comes with MediaTek’s fifth generation AI processing unit, the APU 580.
MediaTek Dimension 8000 Series: Features

  • 200MP camera and support for 4K60 HDR10 + videography.
  • Noise reduction and AI-based Unblock strategy
  • Simultaneous dual camera HDR video recording.
  • Leading 3GPP R16-ready 5G modem to enhance sub-6GHz performance using 2CC carrier aggregation.
  • 5G UltraSave 2.0 Power-Saving Enhancement Suite for enhanced efficiency.
  • Support for Wi-Fi 6E and Bluetooth 5.3




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